Finite Element Simulation of Temperature Field during Grinding of SiCp/Al Composites

被引：2
|
作者：
Zhang, C. Y. [1 ]
Zhou, L. [1 ]
Huang, S. T. [1 ]
机构：
[1] Shenyang Ligong Univ, Sch Mech Engn, Shenyang 110159, Peoples R China
来源：
ADVANCES IN GRINDING AND ABRASIVE TECHNOLOGY XVI | 2011年 / 487卷
关键词：
SiCp/Al composites; Grinding; Temperature field; Heat flux;
D O I：
10.4028/www.scientific.net/KEM.487.70
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
Based on the theory of grinding temperature field and the grinding forces obtained from the experiment, the heat flow during grinding of SiCp/Al composites was calculated. The temperature distributions have been simulated during grinding process in the case of diamond wheel and SiC wheel. The effects of grinding wheel, workpiece speed and grinding depth on the grinding temperature field were discussed. The results show that the grinding temperature with SiC wheel is much higher than that of diamond wheel in the same grinding condition, and the grinding temperature gradually decreases with the increasing of the workpiece speed or the decreasing of the grinding depth for both the diamond wheel and SiC wheel.
引用
收藏
页码：70 / 74
页数：5
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