Effects on etching rates of copper in ferric chloride solutions

被引：21

作者：

Cai, J ^{[1
]}

Ma, JS ^{[1
]}

Wang, GQ ^{[1
]}

Tang, XY ^{[1
]}

机构：

[1] Tsing Hua Univ, Dept Mat Sci & Engn, Beijing 100084, Peoples R China

来源：

2ND 1998 IEMT/IMC SYMPOSIUM | 1998年

关键词：

D O I：

10.1109/IEMTIM.1998.704541

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Influences of several factors on etching rates of Cu in FeCl3 etchant are studied with a spray etching apparatus in this paper. The etching surfaces of Cu are analyzed by XRD and it proves that there is a CuCl passitivation film on the etching surface. A brief explanation is offered based on the relationship between etching rate and etching time. It indicates that cations influence the etching rate as the effects of different chlorides on etching rates have been studied. Additionally, the quantity of copper dissolved in FeCl3 etchant and regeneration of spent etchants are also investigated in this paper.

引用

页码：144 / 148

页数：5

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