Study of the thermal behavior of double-sided cooled power modules

被引:0
|
作者
Catalano, Antonio Pio [1 ]
Scognamillo, Ciro [1 ]
Castellazzi, Alberto [2 ]
Codecasa, Lorenzo [3 ]
D'Alessandro, Vincenzo [1 ]
机构
[1] Univ Federico II, Dept Elect Engn & Informat Technol, I-80125 Naples, Italy
[2] Kyoto Univ Adv Sci KUAS, Fac Engn, Dept Mech & Elect Syst, Solid State Power Proc SP2 Lab, Kyoto, Japan
[3] Politecn Milan, Dept Elect Informat & Bioengn, Milan, Italy
关键词
ELECTRONICS;
D O I
10.1109/THERMINIC52472.2021.9626525
中图分类号
O414.1 [热力学];
学科分类号
摘要
In this paper, the thermal behavior of double sided cooled (DSC) power modules (PMs) is investigated through an in-depth analysis based on finite-element method simulations. Although the innovative DSC technology undoubtedly improves the electrical performance and mechanical ruggedness of power modules, its promising thermal behavior - characterized by peculiar heat pathways - deserves to be further discussed. DSC PMs are analyzed by activating and de-activating each cooling surface in a wide range of boundary conditions. To provide a comprehensive explanation of the thermal phenomena occurring in such assemblies, a steady-state model relying on an equivalent thermal circuit is proposed.
引用
收藏
页数:5
相关论文
共 50 条
  • [21] Modeling and Characterizing for Thermal Resistance of Double-sided Cooling Power Module
    Yu Y.
    Zeng Z.
    Sun P.
    Wang L.
    Wang J.
    Ou K.
    Zhongguo Dianji Gongcheng Xuebao/Proceedings of the Chinese Society of Electrical Engineering, 2022, 42 (01): : 290 - 301
  • [22] A Double-Sided Cooling GaN Power Module with High Thermal Performance
    Li, Bingyang
    Wang, Kangping
    Zhu, Hongkeng
    Xie, Yiting
    Yang, Xu
    Wang, Laili
    2020 IEEE 9TH INTERNATIONAL POWER ELECTRONICS AND MOTION CONTROL CONFERENCE (IPEMC2020-ECCE ASIA), 2020, : 2167 - 2172
  • [23] Double-sided cooling for high power IGBT modules using flip chip technology
    Gillot, C
    Schaeffer, C
    Massit, C
    Meysenc, L
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2001, 24 (04): : 698 - 704
  • [24] Double-sided cooling for high power IGBT modules using flip chip technology
    Gillot, C
    Schaeffer, C
    Ferret, R
    Massit, C
    Meysenc, L
    IAS 2000 - CONFERENCE RECORD OF THE 2000 IEEE INDUSTRY APPLICATIONS CONFERENCE, VOLS 1-5, 2000, : 3016 - 3020
  • [25] A Double-Sided Cooled Split-Phase SiC Power Module With Fuzz Button Interposer
    Emon, Asif Imran
    Wu, Yuxuan
    Li, Yang
    Mirza, Abdul Basit
    Deng, Shiyue
    Luo, Fang
    IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2023, 11 (05) : 4918 - 4928
  • [26] Low-Voltage AC Drive Based on Double-Sided Cooled IGBT Press-Pack Modules
    Kicin, Slavo
    Laitinen, Matti
    Haederli, Christoph
    Sikanen, Jukka
    Grinberg, Roman
    Liu, Chunlei
    Fabian, J. -H.
    Hamidi, Amina
    IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2012, 48 (06) : 2140 - 2146
  • [27] DOUBLE-SIDED THERMAL CONDUCTION MODULE.
    Anon
    IBM technical disclosure bulletin, 1985, 28 (03):
  • [28] Failure Mechanism and Reliability Research of Solder Layer Tilt in Double-Sided Cooling Power Modules
    Sun, Guoliao
    Jing, Wen
    Lu, Siyuan
    Peng, Cheng
    Zhu, Wenhui
    Wang, Liancheng
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2024, 14 (09): : 1585 - 1592
  • [29] New Double-Sided SMT Power Inductor
    Josifovic, Ivan
    Popovic-Gerber, Jelena
    Ferreira, Jan Abraham
    IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2013, 49 (04) : 1637 - 1648
  • [30] A double-sided PDMS mold for double-sided embossing by rollers
    Hsu, Ming-Huai
    Tsai, Yao-Yang
    He, Jyun-Wei
    Yang, Sen-Yeu
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2024, 30 (01): : 47 - 54