A low-cost substrate transfer technology for fully integrated transceivers

被引：15

作者：

Dekker, R ^{[1
]}

van Deurzen, MHWA ^{[1
]}

van der Einden, WTA ^{[1
]}

Maas, HGR ^{[1
]}

Wagemans, AG ^{[1
]}

机构：

[1] Philips Res Labs, NL-5656 AA Eindhoven, Netherlands

来源：

PROCEEDINGS OF THE 1998 BIPOLAR/BICMOS CIRCUITS AND TECHNOLOGY MEETING | 1998年

关键词：

D O I：

10.1109/BIPOL.1998.741902

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A low-cost post-processing technology to transfer on waferscale, circuits fabricated in any IC process, to an alternative substrate e.g, glass is presented. This technology combines the advantages of standard silicon IC processing with a complete freedom of substrate choice and enables the integration of high quality passive components and completely eliminates cross-talk between critical circuit parts.

引用

页码：132 / 135

页数：4

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