An Architecture With Pipelined Background Suppression and In-Situ Noise Cancelling for 2D/3D CMOS Image Sensor

被引:20
|
作者
Choi, Jaehyuk [1 ]
Shin, Jungsoon [1 ]
Kang, Byongmin [1 ]
机构
[1] Samsung Adv Inst Technol, Yongin 446712, Gyeonggi, South Korea
关键词
Background suppression; CMOS image sensor; demodulation pixel; depth sensor; dynamic range; in-pixel capacitor; programmable gain amplifier; range finding; shared pixel; architecture; three-dimensional image sensor; time-of-flight; OF-INTEREST; ALGORITHM;
D O I
10.1109/TCSI.2014.2346112
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We present a CMOS image sensor with integrated background suppression scheme for detecting small signals out of unwanted background signals. For the background suppression, differential signals with suppressed common-mode background signals are sampled within a short sub-sensing time in order to avoid the saturation from strong background signals. Analog differential signals are digitally accumulated multiple times in one integration time for high SNR. The column-parallel background suppression circuits are pipelined in order to achieve short sub-sensing time. Moreover, additional operations for the noise cancelling are merged with the background suppression and no extra timing for the noise cancelling is required during the sub-sensing time. In order to suppress stronger background signals, sensitivity can be adjusted to be decreased using in-pixel capacitors when strong background signals are present. The prototype image sensor with 1328 1008 pixel array has been fabricated with a 0.11 mu m 1P4M CIS process. We have successfully captured images from the fabricated sensor chip with strong background signal over 10 klx scene illuminance without optical filters. The background-to-signal ratio is 32.1 dB.
引用
收藏
页码:100 / 109
页数:10
相关论文
共 50 条
  • [21] 2D to 3D Medical Image Colorization
    Mathur, Aradhya Neeraj
    Khattar, Apoorv
    Sharma, Ojaswa
    2021 IEEE WINTER CONFERENCE ON APPLICATIONS OF COMPUTER VISION WACV 2021, 2021, : 2846 - 2855
  • [22] 3D Sequential Process Integration for CMOS Image Sensor
    Nakazawa, K.
    Yamamoto, J.
    Mori, S.
    Okamoto, S.
    Shimizu, A.
    Baba, K.
    Fujii, N.
    Uehara, M.
    Hiramatsu, K.
    Kumano, H.
    Matsumoto, A.
    Zaitsu, K.
    Ohnuma, H.
    Tatani, K.
    Hirano, T.
    Iwamoto, H.
    2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2021,
  • [23] 3D Contactless Chiplet Interconnects for CMOS Image Sensor
    Xu Z.
    Xu Y.
    Ma T.
    Du L.
    Du Y.
    Dianzi Yu Xinxi Xuebao/Journal of Electronics and Information Technology, 2023, 45 (09): : 3150 - 3156
  • [24] Computational SAR ADC for a 3D CMOS image sensor
    Verdant, Arnaud
    Dupret, Antoine
    Tchagaspanian, Michael
    Peizerat, Arnaud
    2012 IEEE 10TH INTERNATIONAL NEW CIRCUITS AND SYSTEMS CONFERENCE (NEWCAS), 2012, : 337 - 340
  • [25] A 2D/3D Data Fusion with Range Estimation on 2D sensor
    Takashi, Matsuzaki
    Hiroshi, Kameda
    Kazuhiko, Yamamoto
    Tatsuo, Fuji
    Ryoji, Maekawa
    2008 PROCEEDINGS OF SICE ANNUAL CONFERENCE, VOLS 1-7, 2008, : 3296 - +
  • [26] Toward Exploring the 3D Supramolecular Architecture of Centrosomes In-Situ
    Mahamid, J.
    Hyman, A.
    Baumeister, W.
    ADVANCES IN IMAGING AND ELECTRON PHYSICS, VOL 179, 2013, 179 : 147 - 147
  • [27] System on chip approach for a SIMD architecture dedicated to 2D and 3D image processing
    Denoulet, J
    Dulac, D
    REAL-TIME IMAGING VII, 2003, 5012 : 92 - 101
  • [28] Generation of 3D image sequences from mixed 2D and 3D image sources
    Börcsök, J
    WORLD MULTICONFERENCE ON SYSTEMICS, CYBERNETICS AND INFORMATICS, VOL XVII, PROCEEDINGS: CYBERNETICS AND INFORMATICS: CONCEPTS AND APPLICATIONS (PT II), 2001, : 386 - 388
  • [29] Method of converting a 2D image into a stereoscopic 3D image
    Krasil'nikov, N. N.
    Krasil'nikova, O. I.
    JOURNAL OF OPTICAL TECHNOLOGY, 2014, 81 (02) : 68 - 74
  • [30] QUANTUM NOISE IN 2D PROJECTIONS AND 3D RECONSTRUCTIONS
    SAXBERG, BEH
    SAXTON, WO
    ULTRAMICROSCOPY, 1981, 6 (01) : 85 - 90