UV-assisted processing for advanced dielectric films

被引：0
|
作者：
Dharmadhikari, V [1 ]
Sims, JS [1 ]
Varadarajan, B [1 ]
Chang, S [1 ]
Niu, D [1 ]
Shrinivasan, K [1 ]
机构：
[1] Helix Technol Corp, Granville Phillips Vacuum Instrumentat, Longmont, CO 80503 USA
来源：
SOLID STATE TECHNOLOGY | 2005年 / 48卷 / 03期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Ultraviolet-assisted thermal processing (UVTP) is emerging as a viable film-modification technology for advanced dielectric applications. As a post-deposition process, UVTP enhances dielectric film properties by combining UV photon energy and thermal processing to modify the composition and structure of the films. Tests show that UVTP can facilitate the production of high-stress silicon nitride films and improve the mechanical strength and adhesion of low-k dielectric films.
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页码：43 / +
页数：4
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