共 50 条
- [2] Failure analysis of foreign materials in electronic packaging assembly PROCEEDINGS OF THE SEVENTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN, PACKAGING AND FAILURE ANALYSIS (HDP'05), 2005, : 234 - 237
- [3] Analysis of Green Packaging Materials and Packaging Emotion PROCEEDINGS OF THE 2017 INTERNATIONAL CONFERENCE ON ECONOMICS AND MANAGEMENT, EDUCATION, HUMANITIES AND SOCIAL SCIENCES (EMEHSS 2017), 2017, 86 : 414 - 417
- [4] Studies of Atomic Force Microscopy and Application in Advanced Packaging, Materials Characterization and Failure Analysis 2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
- [5] PACKAGING DESIGN, MATERIALS AND PROCESSES - FAILURE PREVENTION IN HYBRIDS MICROPROCESSING AND MICROPROGRAMMING, 1987, 19 (05): : 425 - 425
- [6] Failure Analysis and Test for High Speed Packaging, HDMI Packaging and QSFP Packaging 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010, : 1158 - 1161
- [7] Analysis of Environmentally Friendly Packaging Materials in Modern Packaging Design FRONTIERS OF MANUFACTURING AND DESIGN SCIENCE III, PTS 1 AND 2, 2013, 271-272 : 60 - 63
- [8] Failure modes and FEM analysis of microelectronic packaging FRACTURE AND DAMAGE MECHANICS V, PTS 1 AND 2, 2006, 324-325 : 455 - +
- [9] Analysis on the Failure Modes and Mechanisms of LED Packaging 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 1500 - 1502