Failure Analysis and Test for High Speed Packaging, HDMI Packaging and QSFP Packaging

被引：0
|
作者：
Xiang, Haifei [1 ]
Song, Jian [1 ]
Liu, Fengman [1 ]
Gao, Wei [1 ]
Li, Baoxia [1 ]
Wan, Lixi [1 ]
机构：
[1] Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
来源：
2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP) | 2010年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper we present several failures in optical packaging. Then we analysis the main reasons of these failures. Next, we suggest ways to avoid similar failures. Several simple examinations are also introduced. Innovative diagnostics methods are described and time saving test methods are described.
引用
收藏
页码：1158 / 1161
页数：4
相关论文
共 50 条
  • [1] High speed digital packaging
    Lindner, A
    MICROWAVE JOURNAL, 2003, 46 (05) : 248 - +
  • [2] HIGH SPEED HIGH TECH PACKAGING
    KHYM, FP
    JOURNAL OF THE AMERICAN OIL CHEMISTS SOCIETY, 1985, 62 (04) : 617 - 617
  • [3] Failure Analysis of Packaging Materials
    Tague, Thomas J., Jr.
    SPECTROSCOPY, 2016, : 16 - 16
  • [4] Failure Analysis of Packaging Materials
    Tague, Thomas J., Jr.
    SPECTROSCOPY, 2015, : 12 - 12
  • [5] Packaging of high speed optical receivers
    Agrawal, N
    Rue, J
    Perkins, J
    Wall, T
    Shukla, A
    Khan, N
    LEOS 2000 - IEEE ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS. 1 & 2, 2000, : 794 - 795
  • [6] HIGH SPEED COATING OF PACKAGING MATERIALS
    不详
    JOURNAL OF THE OIL & COLOUR CHEMISTS ASSOCIATION, 1969, 52 (04): : 368 - &
  • [7] High-speed optoelectronic packaging
    Velsher, B
    GAAS IC SYMPOSIUM - 24TH ANNUAL, TECHNICAL DIGEST 2002, 2002, : 15 - 18
  • [8] Packaging of high speed DFB laser diodes
    Lindgren, S
    Ahlfeldt, H
    Kerzar, B
    Kjebon, O
    22ND EUROPEAN CONFERENCE ON OPTICAL COMMUNICATIONS, PROCEEDINGS, VOLS 1-6: CO-LOCATED WITH: 2ND EUROPEAN EXHIBITION ON OPTICAL COMMUNICATION - EEOC '96, 1996, : A97 - A102
  • [9] High-speed packaging lines for fasteners
    Wire, 6 (353):
  • [10] ADVANCED TECHNOLOGY FOR HIGH-SPEED PACKAGING
    HOLZ, G
    PROCEEDINGS OF THE TECHNICAL CONFERENCE : NINTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, VOLS 1 AND 2, 1989, : 721 - 724
12345