A recent study has highlighted an existing controversy among experimental measurements and theoretical models on the size-dependent elastic behavior of silicon nanowires. Some measurements have depicted a significant size-dependent elastic response, while several studies report a negligible change on the elastic modulus of silicon nanowires through size reduction. To address such contrast, this work studies the surface stress contribution on the size-dependent elastic behavior of silicon nanowires. Molecular dynamics simulations are employed to investigate the influence of size, crystal orientation, boundary condition, and the residual surface stress on the incorporation of the surface stress in the mechanical properties of silicon nanowires. This is accomplished by a primary atomic stress analysis. The implication of the surface stress on the bending behavior is then calculated for silicon nanowires along 100 and 110 crystal orientations having { 100 } and { 100 } / { 110 } transverse surfaces, respectively. This study demonstrates, for the first time, the role played by the surface stress to reduce the elastic modulus of 110 silicon nanowires, which is comparable with experimental measurements on wires with the same size and crystal orientation. The present work enlightens the incorporation of the surface stress on the mechanical behavior of silicon nanowires for the explanation of existing studies and implementation for future investigations.
机构:
Hong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Kowloon, Hong Kong, Peoples R ChinaHong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Kowloon, Hong Kong, Peoples R China
Zhou XiaoYe
Ren Hang
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Hong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Kowloon, Hong Kong, Peoples R ChinaHong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Kowloon, Hong Kong, Peoples R China
Ren Hang
Huang BaoLing
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Hong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Kowloon, Hong Kong, Peoples R ChinaHong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Kowloon, Hong Kong, Peoples R China
Huang BaoLing
Zhang TongYi
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Hong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Kowloon, Hong Kong, Peoples R ChinaHong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Kowloon, Hong Kong, Peoples R China
机构:
Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Clear Water BayDepartment of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Clear Water Bay
ZHOU XiaoYe
REN Hang
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Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Clear Water BayDepartment of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Clear Water Bay
REN Hang
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HUANG BaoLing
ZHANG TongYi
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Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Clear Water BayDepartment of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Clear Water Bay