Design, fabrication, and characterization of electrical and fluidic interconnections for a multi-chip microelectroflumic bench

We present the design, fabrication, and characterization of a multi-chip microelectrofluidic bench, achieving both electrical and fluidic interconnections with a simple, low-loss and low-temperature electrofluidc interconnection method. We design 4-chip microelectrofluidic bench, having three electrical pads and two fluidic I/O ports. Each device chip, having three electrical interconnections and a pair of two fluidic I/O interconnections, can be assembled to the microelectofluidic bench with electrical and fluidic interconnections. In the electrical and fluidic characterization, we measure the electrical resistance of 0.26 Omega/mm in the line and 0.64 +/- 0.58 Omega in the interconnection. Also, we measure the average pressure drop of 13.6 similar to 125.4 Pa/mm with the nonlinearity of 3.1% for the flow-rates of 10 similar to 100 mu l/min in the line and 17Pa with the uncertainty of 65Pa in the interconnection.