Modelling of solid-state diffusion bonding with a real rough surface

被引：2
|
作者：
Wu, GQ [1 ]
Huang, Z [1 ]
Li, HY [1 ]
机构：
[1] Beijing Univ Aeronaut & Astronaut, Sch Mat Sci & Engn, Beijing 100083, Peoples R China
来源：
PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5 | 2005年 / 475-479卷
关键词：
diffusion bonding; computer based simulation; rough surface; diffusion;
D O I：
10.4028/www.scientific.net/MSF.475-479.3185
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
By using the real information of the intended bonding surface and considering the effect of the diffusion distance in a definite time, a new theoretical model for diffusion bonding was proposed. The model, reflecting the characteristic of real bonding process effectively, realizes the visualization and simulation of the bonding process in which many voids disappear dynamically. The results show that the simulation is close to those experimental results from the phenomena of voids closure.
引用
收藏
页码：3185 / 3188
页数：4
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