Electro-optical line cards with multimode polymer waveguides for chip-to-chip interconnects

被引：0

作者：

Zhu, Long Xiu ^{[1
]}

Immonen, Marika ^{[2
]}

Wu, Jinhua ^{[1
]}

Yan, Hui Juan ^{[1
]}

Shi, Ruizhi ^{[1
,3
]}

Chen, Peifeng ^{[1
]}

Rapala-Virtanen, Tarja ^{[4
]}

机构：

[1] TTM Technol, 685 Lian Yang Rd Songjiang, Shanghai 201600, Peoples R China

[2] TTM Technol Inc, Salo 24100, Finland

[3] TTM Technol, Shanghai 201600, Peoples R China

[4] TTM Technol, Guangzhou 510663, Guangdong, Peoples R China

来源：

OPTOELECTRONIC DEVICES AND INTEGRATION V | 2014年 / 9270卷

关键词：

Optical Interconnects; Optical Printed Circuit Boards; Polymer Waveguides; Optical Backplanes; Light Coupling; Parallel Optical Links;

D O I：

10.1117/12.2071965

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, we report developments of electro-optical PCBs (EO-PCB) with low-loss (<0.05dB/cm) polymer waveguides. Our results shows successful fabrication of complex waveguide structures part of hybrid EO-PCBs utilizing production scale process on standard board panels. Test patterns include 90 degrees bends of varying radii (40mm - 2mm), waveguide crossing with varied crossing angles (90 degrees-20 degrees), cascaded bends with varying radii, splitters and tapered waveguides. Full ranges of geometric configurations are required to meet practical optical routing functions and layouts. Moreover, we report results obtained to realize structures to integrate optical connectors with waveguides. Experimental results are shown for MT in-plane and 90 degrees out-of-plane optical connectors realized with coupling loss <2dB and < 2.5 dB, respectively. These connectors are crucial to realize efficient light coupling from/to TX/RX chip-to-waveguide and within waveguide-to-fiber connections in practical optical PCBs. Furthermore, we show results for fabricating electrical interconnect structures e. g. tracing layers, vias, plated vias top/bottom and through optical layers. Process compatibility with accepted practices and production scale up for high volumes are key concerns to meet the yield target and cost efficiency. Results include waveguide characterization, transmission loss, misalignment tolerance, and effect of lamination. Critical link metrics are reported.

引用

页数：9

共 50 条

[41] 5-Gb/s chip-to-chip optical interconnection using polymeric waveguides
Kim, Do-Won
Cho, In-Kui
Ahn, Seung Ho
Park, Hyo-Hoon
2007 PACIFIC RIM CONFERENCE ON LASERS AND ELECTRO-OPTICS, VOLS 1-4, 2007, : 243 - 244
[42] Photonic Waveguide Bonds - A Novel Concept for Chip-to-Chip Interconnects
Lindenmann, N.
Kaiser, I.
Balthasar, G.
Bonk, R.
Hillerkuss, D.
Freude, W.
Leuthold, J.
Koos, C.
2011 OPTICAL FIBER COMMUNICATION CONFERENCE AND EXPOSITION (OFC/NFOEC) AND THE NATIONAL FIBER OPTIC ENGINEERS CONFERENCE, 2011,
[43] Chip-to-Chip Plasmonic Interconnects and the Activities of EU Project NAVOLCHI
Melikyan, A.
Sommer, M.
Muslija, A.
Kohl, M.
Muehlbrandt, S.
Mishra, A.
Calzadilla, V.
Justo, Y.
Martinez-Pastor, J. P.
Tomkos, I.
Scandurra, A.
Van Thourhout, D.
Hens, Z.
Smit, M.
Freude, W.
Koos, C.
Leuthold, J.
2012 14TH INTERNATIONAL CONFERENCE ON TRANSPARENT OPTICAL NETWORKS (ICTON 2012), 2012,
[44] Ultrawideband design challenges for wireless chip-to-chip communications and interconnects
Celebi, Hasari
Ahin, Mustafa E.
Arslan, Huseyin
Haque, Jamal
Prado, Edward R.
Markell, David P.
2006 IEEE AEROSPACE CONFERENCE, VOLS 1-9, 2006, : 2408 - +
[45] Free-space holographic optical interconnects for board-to-board and chip-to-chip interconnections
Yeh, JH
Kostuk, RK
OPTICS LETTERS, 1996, 21 (16) : 1274 - 1276
[46] PARALLEL N2 WEIGHTED RECONFIGURABLE NETWORKS FOR OPTICAL NEURON AND CHIP-TO-CHIP INTERCONNECTS
LI, Y
EICHMANN, G
OPTICS COMMUNICATIONS, 1988, 67 (04) : 251 - 255
[47] Novel concept for three-dimensional polymer waveguides for optical on-chip interconnects
Schroeder, M.
Buelters, M.
von Kopylow, C.
Bergmann, R. B.
JOURNAL OF THE EUROPEAN OPTICAL SOCIETY-RAPID PUBLICATIONS, 2012, 7
[48] Boosting Off-chip Interconnects through Chip-to-Chip Capacitive Coupled Communication
Zhang, Xiang
Park, Dongwon
Cheng, Chung-Kuan
2017 IEEE 26TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS), 2017,
[49] New approaches for chip-to-chip interconnects: integrating porous silicon with MOEMS
Song, Da
Tokranova, Natalya
Gracias, Alison
Castracane, James
JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2008, 7 (02):
[50] Performance Modeling and Broadband Characterization of Chip-to-Chip Interconnects with Rough Surfaces
Kumar, Somesh
Sharma, Rohit
PROCEEDINGS OF THE 2016 IEEE 18TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2016, : 629 - 632

← 1 2 3 4 5 →