Low power and High speed OOK Modulator for Wireless Inter-Chip Communications

被引：0

作者：

Lee, Hae Jin ^{[1
]}

Yoon, Chong Hyun ^{[1
]}

Lee, Joong Geun ^{[1
]}

Lee, Chae Jun ^{[1
]}

Kang, Dong Min ^{[1
]}

Song, In Sang ^{[1
]}

Cho, Sung Jun ^{[1
]}

Kim, Hong Yi ^{[1
]}

Oh, Inn Yeol ^{[1
]}

Park, Chul Soon ^{[1
]}

机构：

[1] Korea Adv Inst Sci & Technol, Dept Elect Engn, 291 Daehak Ro, Daejeon 305701, South Korea

来源：

2015 IEEE 15TH TOPICAL MEETING ON SILICON MONOLITHIC INTEGRATED CIRCUITS IN RF SYSTEMS (SIRF) | 2015年

关键词：

CMOS; millimeter-wave; Chip-to-chip interconnect; OOK modulation; high data rate;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Millimeter-wave on-off keying (OOK) modulator for wireless inter-chip communications is proposed. The proposed modulator not only has a wide bandwidth which allows the high speed modulation but also operates with a low power consumption enhancing the power efficiency and assures the inter-chip communication. With wide bandwidth and the OOK modulation scheme, it can process data having 12 Gbps while consuming a little DC power showing the energy efficiency of 0.75 pJ/bit. The on/off ratio of the circuit is higher than 25 dB assuring little degradation on the SNR. The chip size using 65nm GP RF CMOS is 0.254 mm(2) which is very compact compared to other state-of-the-art works.

引用

页码：76 / 79

页数：4

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