A modular triple characterization of circuit signatures

被引:0
|
作者
Koban, Lori [1 ]
机构
[1] Univ Maine Farmington, Dept Math & Comp Sci, Orono, ME 04469 USA
[2] Univ Maine Farmington, Dept Math, Farmington, ME 04938 USA
关键词
D O I
10.1016/j.ejc.2006.11.003
中图分类号
O1 [数学];
学科分类号
0701 ; 070101 ;
摘要
We study the modular triples of circuits of a matroid and use them to characterize four types of circuit signatures, three of which are known (weak orientations, orientations, and ternary signatures) and one of which is new (lifting signatures). Lifting signatures allow us to specify a linear class of circuits in a matroid, and thereby the lift of the matroid, by labeling the elements from a group in the manner of Dowling and Kelly. (c) 2007 Elsevier Ltd. All rights reserved.
引用
收藏
页码:159 / 170
页数:12
相关论文
共 50 条
  • [1] Triple transistor based triple modular redundancy with embedded voter circuit
    Mukherjee, Atin
    Dhar, Anindya Sundar
    [J]. MICROELECTRONICS JOURNAL, 2019, 87 : 101 - 109
  • [2] Modified triple modular redundancy structure based on asynchronous circuit technique
    Rui, Gong
    Wei, Chen
    Fang, Liu
    Kui, Dai
    Wang Zhiying
    [J]. 21ST IEEE INTERNATIONAL SYMPOSIUM ON DEFECT AND FAULT-TOLERANCE IN VLSI SYSTEMS, PROCEEDINGS, 2006, : 184 - +
  • [3] A modular triple
    Amghibech, S
    Beckwith, D
    Chapman, R
    Han, NJ
    Jeon, SY
    Locke, SC
    Lossers, OP
    Mikata, Y
    Myerson, G
    Pranesachar, CR
    Stadler, A
    Steelman, JH
    Stong, R
    Tang, HT
    Tyler, DB
    [J]. AMERICAN MATHEMATICAL MONTHLY, 2005, 112 (03): : 279 - 280
  • [4] Modular Printed Circuit Boards for Broadband Characterization of Nanoelectronic Quantum Devices
    Tagliaferri, Marco Lorenzo Valerio
    Crippa, Alessandro
    Cocco, Simone
    De Michielis, Marco
    Fanciulli, Marco
    Ferrari, Giorgio
    Prati, Enrico
    [J]. IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2016, 65 (08) : 1827 - 1835
  • [5] Modular lattice signatures, revisited
    Das, Dipayan
    Hoffstein, Jeffrey
    Pipher, Jill
    Whyte, William
    Zhang, Zhenfei
    [J]. DESIGNS CODES AND CRYPTOGRAPHY, 2020, 88 (03) : 505 - 532
  • [6] On modular decompositions of system signatures
    Marichal, Jean-Luc
    Mathonet, Pierre
    Spizzichino, Fabio
    [J]. JOURNAL OF MULTIVARIATE ANALYSIS, 2015, 134 : 19 - 32
  • [7] Modular lattice signatures, revisited
    Dipayan Das
    Jeffrey Hoffstein
    Jill Pipher
    William Whyte
    Zhenfei Zhang
    [J]. Designs, Codes and Cryptography, 2020, 88 : 505 - 532
  • [8] Accurate Predictions of Genetic Circuit Behavior from Part Characterization and Modular Composition
    Davidsohn, Noah
    Beal, Jacob
    Kiani, Samira
    Adler, Aaron
    Yaman, Fusun
    Li, Yinqing
    Xie, Zhen
    Weiss, Ron
    [J]. ACS SYNTHETIC BIOLOGY, 2015, 4 (06): : 673 - 681
  • [9] On signatures of elliptic curves and modular forms
    Andrzej Dąbrowski
    Jacek Pomykała
    Sudhir Pujahari
    [J]. The Ramanujan Journal, 2023, 60 : 505 - 516
  • [10] On signatures of elliptic curves and modular forms
    Dabrowski, Andrzej
    Pomykala, Jacek
    Pujahari, Sudhir
    [J]. RAMANUJAN JOURNAL, 2023, 60 (02): : 505 - 516