FABRICATION OF AN ELECTRO-THERMAL MICRO GRIPPER USING SILVER-NICKEL INK

被引:0
|
作者
Feng, Yao-Yun [1 ]
Chen, Shih-Jui [1 ]
Hsieh, Ping-Hsun [1 ]
机构
[1] Natl Cent Univ, Dept Mech Engn, Taoyuan, Taiwan
关键词
DESIGN;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reports a miniaturized electro-thermal gripper with a novel fabrication process applying composite silver-nickel ink. Compared to state of the art, a thick resistive structure is dispensed on a silicon wafer by an injecting machine, which will decrease the fabrication process complexity. Device size, driving power and deformation of the gripper could be further improved by stacking multi-layers of silver-nickel structures. In the paper, the electrical and mechanical behaviors of the micro-grippers are well characterized. The displacement of each arm is observed to be 310.6 mu m for the applied current of 0.26 A. The maximum power dissipation is 400 mW for the actuators. The fabricated micro gripper can grip a small ball with a diameter of 1.3 mm.
引用
收藏
页码:1141 / 1144
页数:4
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