High Temperature High Strain Rate Properties of SAC305 with Effect of 100 °C Storage for Prolonged Duration

Electronic components can be subjected to shock-impact, vibration, and high temperatures in applications such as automobile, military and oil/gas scanning. Electronic components with this harsh atmosphere can face strain rates of 1 to 100 per second and ambient temperatures of up to 200 degrees C. There are insufficient data for plead-free solder alloys at higher thermal aging and strain rates. For SAC305 lead-free solder alloys, previously published and available records are restricted to both lower strain rates and lower temperature and storage durations. There are not many records available for the high temperature storage for the SAC305 material. This paper represents uniaxial tensile testing of SAC305 lead-free solder, with a high strain rate and high temperature for thermal aging, at various surrounding temperatures from 25 degrees C to 200 degrees C. For 6 months and 8 months, the specimens were preserved at 100oC for thermal aging. Test results for SAC305 thermally aging solder specimens were measured at 10, 35, 50, and 75 per second strain rates at various operating temperatures ranging from 25 degrees C to 200 degrees C using reflow profiles indicating solder joint assemblies. Stress-Strain curves are made for various strain rates and operational temperatures for thermally aged specimens for thermally aged specimens up to 8 months aging durations. The research findings were consistent with the Anand Viscoplasticity model for the SAC305 and the anand constants are determined by evaluating the stress strain behavior, based on high temperature specimen storage, for the large range of temperature and strain rates.