Measuring mixed-signal substrate coupling

被引：4
|
作者：
Rolain, Y [1 ]
Van Moer, W
Vandersteen, G
van Heijningen, M
机构：
[1] Free Univ Brussels, Elect Measurement Dept, Brussels, Belgium
[2] IMEC, Louvain, Belgium
来源：
IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT | 2001年 / 50卷 / 04期
关键词：
high frequency measurements; mixed signal measurements; substrate noise; time domain network analyzer;
D O I：
10.1109/19.948307
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A measurement method is proposed to characterize the substrate coupling between digital and analog sections of a mixed-signal CMOS chip. Induced noise and spurious signals can be measured by a custom-designed analog sensor. This paper proposes a method that, when given such a sensor, allows to measure the crosstalk between digital and analog chip sections. Calibrated sampling scope measurements illustrate the performance of the measurement setup.
引用
收藏
页码：959 / 964
页数：6
相关论文
共 50 条
  • [1] Substrate noise coupling in mixed-signal ICs
    Mahin, MM
    Yuan, JS
    Whittakar, A
    Chian, M
    Ports, K
    PROCEEDINGS IEEE SOUTHEASTCON '98: ENGINEERING FOR A NEW ERA, 1998, : 166 - 169
  • [2] Substrate noise coupling: a pain for mixed-signal systems
    Wambacq, P
    Van der Plas, G
    Donnay, S
    Badaroglu, M
    Soens, C
    VLSI CIRCUITS AND SYSTEMS II, PTS 1 AND 2, 2005, 5837 : 1 - 14
  • [3] Substrate noise coupling in mixed-signal integrated circuits
    Shi, Yibing
    Chen, Guangju
    Wang, Houjun
    Dianzi Keji Daxue Xuebao/Journal of University of Electronic Science and Technology of China, 2000, 29 (02): : 174 - 177
  • [4] Measuring mixed signal substrate coupling.
    Rolain, Y
    Van Moer, W
    Vandersteen, G
    van Heijningen, M
    IMTC/2000: PROCEEDINGS OF THE 17TH IEEE INSTRUMENTATION AND MEASUREMENT TECHNOLOGY CONFERENCE: SMART CONNECTIVITY: INTEGRATING MEASUREMENT AND CONTROL, 2000, : 855 - 859
  • [5] Efficient modelling of substrate noise and coupling in mixed-signal SPICE designs
    Singh, R
    Sali, S
    ELECTRONICS LETTERS, 1997, 33 (07) : 590 - 592
  • [6] Modeling of Substrate Coupling Noise in Lightly Doped Mixed-Signal ICs
    Wang, Yongsheng
    Liu, Shanshan
    Li, Fang
    Lai, Fengchang
    Yu, Mingyan
    2012 INTERNATIONAL CONFERENCE ON OPTOELECTRONICS AND MICROELECTRONICS (ICOM), 2012, : 482 - 485
  • [7] Modeling and analysis of substrate coupling in mixed-signal RF CMOS mixer
    Guo, JH
    Li, L
    Li, ZY
    Tenhunen, H
    Olsson, HK
    ICEMI'99: FOURTH INTERNATIONAL CONFERENCE ON ELECTRONIC MEASUREMENT & INSTRUMENTS, VOLS 1 AND 2, CONFERENCE PROCEEDINGS, 1999, : 610 - 614
  • [8] On-die monitoring of substrate coupling for mixed-signal circuit isolation
    Kosaka, Daisuke
    Fujiwara, Masaki
    Danjo, Takumi
    Nagata, Makoto
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2007, 46 (4B): : 2244 - 2251
  • [9] Efficient methods for modelling substrate coupling in mixed-signal integrated circuits
    Singh, R
    Sali, S
    Woo, WL
    ELECTRONICS & COMMUNICATION ENGINEERING JOURNAL, 2001, 13 (06): : 237 - 248
  • [10] Verification techniques for substrate coupling and their application to mixed-signal IC design
    Cadence Design Systems, San Jose, United States
    IEEE J Solid State Circuits, 3 (354-365):
12345