Effects of surface morphology and C concentration in C-doped GaN buffer on breakdown voltage of AlGaN/GaN HEMTs on free-standing GaN substrate

被引:7
|
作者
Tanabe, Shinichi [1 ]
Watanabe, Noriyuki [1 ]
Uchida, Masahiro [2 ]
Matsuzaki, Hideaki [1 ]
机构
[1] NTT Corp, NTT Device Technol Labs, 3-1 Morinosato Wakamiya, Atsugi, Kanagawa 2430198, Japan
[2] NTT Adv Technol Corp, 3-1 Morinosato Wakamiya, Atsugi, Kanagawa 2430124, Japan
关键词
AlGaN; C doping; free-standing GaN substrates; GaN; high-electron mobility transistors; surface morphology; CHEMICAL-VAPOR-DEPOSITION;
D O I
10.1002/pssa.201532781
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
We report on the validity of using a C-doped GaN buffer to achieve high-breakdown-voltage AlGaN/GaN high-electron mobility transistors (HEMTs) on conductive free-standing GaN substrates. We use trimethygallium to dope C into the buffer. We show that breakdown voltage depends not only on the C concentration of the buffer but also on the surface morphology of the HEMT structure. We demonstrate off-state breakdown voltage of over 2 kV by controlling the C concentration of the buffer, thickness of the buffer, and the surface morphology. (C) 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim [GRAPHICS] .
引用
收藏
页码:1236 / 1240
页数:5
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