Packaging Architecture for Fluidic Components in Microfluidic PCBs

We present a novel packaging architecture for fluidic surface mount components in microfluidic printed circuit boards (PCB)s. The package incorporates sacrificial layers to protect the fluid cavities and inlets/outlets to the component during mounting and integration on a microfluidic circuit board. In this paper we describe the general scheme to package and integrate microfluidic components such as valves, pumps, mixers, etc. in microfluidic PCBs. We also report the use of dry film photoresist as a possible protective sealant for fluidic openings on the package. As an example microfluidic packaged surface mount component, we introduce an opto-fluidic cell counter that can be soldered directly on a PCB and connected to a microfluidic system.