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- [43] Thermal Stresses of TSV and Si Chip in 3D SiP under Device Operation and Reflow Process 2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2014, : 109 - 112
- [45] SMART PROCESSING DEVELOPMENT ON 3D CERAMIC STRUCTURES FOR TERAHERTZ WAVE APPLICATIONS ADVANCED PROCESSING AND MANUFACTURING TECHNOLOGIES FOR STRUCTURAL AND MULTIFUNCTIONAL MATERIALS, 2008, 28 (07): : 79 - 90
- [48] Multi-material 3D Printed Bendable Smart Sensing Structures 2018 IEEE SENSORS, 2018, : 1725 - 1728