共 50 条
- [1] Effects of Corrosion on the Shear Strength of Cu/Sn-9Zn/Cu Lap Joints in 3.5 wt. % NaCl Solution INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE, 2012, 7 (06): : 4951 - 4958
- [3] Effect of Electromigration on Interfacial Reaction in Cu/Sn-9Zn/Cu and Cu/Sn-9Zn/Ni Interconnects 2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016, : 473 - 476
- [5] Effect of electromigration on the tensile strength of Cu/Sn-9Zn/Cu solder interconnects 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 1190 - 1193
- [7] Effect of Stand-off Height on Microstructure and Tensile Strength of Cu/Sn-8Zn-3Bi/Cu and Cu/Sn-9Zn/Cu Solder Joints 2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4, 2009, : 1044 - +
- [8] Effect of Corrosion in Alkaline Solution to the Microstructure and Mechanical Properties of Cu/Sn-9Zn/Cu 5TH INTERNATIONAL CONFERENCE ON RECENT ADVANCES IN MATERIALS, MINERALS AND ENVIRONMENT (RAMM) & 2ND INTERNATIONAL POSTGRADUATE CONFERENCE ON MATERIALS, MINERAL AND POLYMER (MAMIP), 2016, 19 : 247 - 252
- [10] Interfacial growth behavior of Sn-9Zn/additive Cu-particles and Sn-9Zn/Cu-substrate Zhongguo Youse Jinshu Xuebao, 2007, 7 (1083-1089):