Characterization of underfill materials for functional solder bumped flip chips on board applications

被引：3
|
作者：
Lau, JH [1 ]
Chang, C [1 ]
机构：
[1] Express Packaging Syst Inc, Palo Alto, CA 94303 USA
来源：
48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS | 1998年
关键词：
D O I：
10.1109/ECTC.1998.678921
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The curing conditions and material properties such as the TCE (thermal coefficient of expansion), T-g (glass transition temperature), flexural storage modulus, tangent delta, and moisture content of nine different underfill materials from three different vendors are measured. Their flow sate and the effect of moisture content on mechanical (shear) strength in solder bumped flip chips on organic substrate are also determined experimentally. Furthermore, their effects on the electrical performance (voltage) of functional flip chip devices on organic substrate are measured. Finally, a simple methodology is presented for the selection of underfills from the measurement results of these nine different underfill materials.
引用
收藏
页码：1361 / 1371
页数：11
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