A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects

被引:1
|
作者
Kamara, E. [1 ]
Lu, H. [1 ]
Bailey, C. [1 ]
Hunt, C. [2 ]
Di Maio, D. [2 ]
Thomas, O. [2 ]
机构
[1] Univ Greenwich, Computat Mech & Reliabil Grp, London SE10 9LS, England
[2] Natl Phys Lab, Teddington TW11 0LW, Middx, England
关键词
D O I
10.1016/j.microrel.2010.07.152
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Vibration loading can have a significant impact on the reliability of electronic components. Due to the cyclic strain and stress in the materials making up the component these can cause damage and hence wear out failures. The recent move from lead to lead-free soldering by the electronics industry has necessitated the generation of material properties data that will allow accurate prediction of the lead-free solder's performance under vibration conditions. To assess the reliability of lead-free solders under vibration loading, test equipment has been designed for small solder joints. Such test equipment must be able to extract solder mechanical properties and physics of failure fatigue lifetime parameters/models for numerical model and prediction of lifetime of real electronic components. This paper focuses on the design, analysis and development of this type of test facility. (C) 2010 Published by Elsevier Ltd.
引用
收藏
页码:1706 / 1710
页数:5
相关论文
共 50 条
  • [1] Reliability of lead-free solder interconnects - A review
    Tonapi, S
    Gopakumar, S
    Borgesen, P
    Srihari, K
    ANNUAL RELIABILITY AND MAINTAINABILITY SYMPOSIUM, 2002 PROCEEDINGS, 2002, : 423 - 428
  • [2] CHARACTERIZATION OF LEAD-FREE SOLDER INTERCONNECTS RELIABILITY UNDER TORSIONAL LOADS
    Srinivas, Vikram
    Al-Bassyiouni, Moustafa
    Osterman, Michael
    Pecht, Michael
    IMCE2009: PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, VOL 5, 2010, : 211 - 216
  • [3] Lead-free Reliability
    Hwang, Jennie
    SMT Surface Mount Technology Magazine, 2004, 18 (12):
  • [4] Low Temperature Vibration Reliability of Lead-free Solder Joints
    Meier, Karsten
    Ochmann, Maximilian
    Bock, Karlheinz
    Leslie, David
    Dasgupta, Abhijit
    2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 801 - 806
  • [5] Random vibration reliability of BGA lead-free solder joint
    Liu, Fang
    Meng, Guang
    MICROELECTRONICS RELIABILITY, 2014, 54 (01) : 226 - 232
  • [6] A multi-disciplinary study of yttrium effect on the electronic structure of hafnia
    Zagorac, Dejan
    Fonovic, Matej
    Butulija, Svetlana
    Lukovic, Aleksa
    Maksimovic, Vesna
    Zagorac, Jelena
    Matovic, Branko
    JOURNAL OF ALLOYS AND COMPOUNDS, 2025, 1010
  • [7] Vibration fatigue reliability of lead and lead-free solder joint by FORM/SORM
    Lee, Ouk Sub
    Hur, Man Jae
    Park, Yeon Chang
    Kim, Dong Hyeok
    MECHANICAL BEHAVIOR OF MATERIALS X, PTS 1AND 2, 2007, 345-346 : 1393 - +
  • [8] Reliability of lead-free copper columns in comparison with tin-lead solder column interconnects
    Park, SB
    Joshi, R
    Goldmann, L
    54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 82 - 89
  • [9] Multi-disciplinary efforts lead to new ideas
    Josifovska, Svetiana
    ELECTRONICS WORLD, 2006, 112 (1843): : 3 - 3
  • [10] Long-term Reliability of Lead-free Electronic Systems
    Pandian, Guru Prasad
    Ramaswami, Gopala Krishnan
    Hodkiewicz, Melinda
    Cripps, Edward
    Pecht, Michael
    Proceedings of the 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2016, : 305 - 311