Vibration fatigue reliability of lead and lead-free solder joint by FORM/SORM

被引：1
|
作者：
Lee, Ouk Sub [1 ]
Hur, Man Jae [2 ]
Park, Yeon Chang [2 ]
Kim, Dong Hyeok [2 ]
机构：
[1] Inha Univ, Sch Mech Engn, Inchon 402751, South Korea
[2] Inha Univ, Dept Mech Engn, Inchon 402751, South Korea
来源：
MECHANICAL BEHAVIOR OF MATERIALS X, PTS 1AND 2 | 2007年 / 345-346卷
关键词：
solder joint; reliability; failure probability; vibration; FORM; SORM; MCS;
D O I：
10.4028/www.scientific.net/KEM.345-346.1393
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
It is well-known that the vibration significantly affect the life of solder joint. In this paper, the effects of the vibration on the failure probability of the solder joint are studied by using the failure probability models such as the First Order Reliability Method (FORM) and the Second Order Reliability Method (SORM). The accuracies of the results are estimated by a help of the Monte Carlo Simulation (MCS). The reliability of the lead and the lead-free solder joint was also evaluated. The reliability of lead-free solder joint is found to be higher than that of lead solder joint.
引用
收藏
页码：1393 / +
页数：2
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