Thermo-mechanical finite-element modeling of a chip-on-foil bonding process

被引：0
|
作者：
Suter, P [1 ]
Bauknecht, R [1 ]
Graf, T [1 ]
Duran, H [1 ]
Venter, I [1 ]
机构：
[1] HTA Luzern, Inst Elect, CH-6048 Horw, Switzerland
来源：
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems | 2005年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A chip-on-foil (COF) inner-lead bonding (ILB) process for diplay driver ICs is studied by means of thermo-mechanical finite-element modeling (FEM). The residual stress distribution in the assembly after bonding is calculated for different bump arrangements and process parameters. The simulated foil induced shear force on the corner bumps could be correlated to experimentally observed comer bump failures. A redesign of the bumps decreased the failure rate after bonding from typically 1% to typically 0.01%.
引用
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页码：25 / 30
页数：6
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