Laser Assisted Selective Metallization of Polymers

被引：0

作者：

Ratautas, Karolis ^{[1
]}

Jagminiene, Aldona ^{[2
]}

Stankeviciene, Ina ^{[2
]}

Norkus, Eugenijus ^{[2
]}

Raciukaitis, Gediminas ^{[1
]}

机构：

[1] Ctr Phys Sci & Technol, Dept Laser Technol, Vilnius, Lithuania

[2] Ctr Phys Sci & Technol, Dept Catalysis, Vilnius, Lithuania

来源：

2018 13TH INTERNATIONAL CONGRESS MOLDED INTERCONNECT DEVICES (MID) | 2018年

关键词：

Laser-induced selective plating; polymers; electro-less plating; polypropylene; polycarbonate; acrylonitrile butadiene styrene; molded interconnect devices; electronics; SSAIL; LDS; electro-conductive traces;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A new technology for circuit traces production: Selective Surface Activation Induced by Laser (SSAIL) enables to fabricate fine metallic structure on dielectric materials polymers and glass. SSAIL contains three main steps: The first step is surface modification by laser, second - chemical activation of modified areas and the last step is metal deposition by electroless plating. A Picosecond laser was used for writing. The method has been investigated in detail for wide window of laser processing parameters. Sheet resistance measurement of finally plated sample and laser processed surface roughness measurement were carried out. This new technique can reduce production cost of circuit traces for molded interconnect devices

引用

页码：30 / 32

页数：3

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