A High-speed Wireless Data Transfer for Non Destructive Testing

被引：0

作者：

Dangba, Hanh ^{[1
]}

Bui-ngoc, Thang ^{[1
]}

Kim, Hae-jin ^{[1
]}

Song, Jun-hee ^{[1
]}

Chung, Chaiyoon ^{[1
]}

Byun, Gyung-Su ^{[1
]}

机构：

[1] Inha Univ, Sch Informat & Commun Engn, Incheon 22212, South Korea

来源：

18TH INTERNATIONAL SOC DESIGN CONFERENCE 2021 (ISOCC 2021) | 2021年

关键词：

Wireless data transfer; WDT; wafer-level testing;

D O I：

10.1109/ISOCC53507.2021.9613878

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

This paper presents a sub-THz wireless data transfer (WDT) design for low-power chip-to-chip communication using on-off keying (OOK) modulation scheme. Input baseband data is modulated with a 90-GHz clock signal, which is generated by the proposed near-threshold voltage-controlled oscillator. The modulated signal is transferred through an air media by using the proposed inductive coupler. Since the sub-THz frequency band is utilized, a data rate of 10 Gb/s could be achieved while the chip size is only 0.2 mm(2) and 0.3 mm(2) for transmitter and receiver, respectively. The proposed WDT design consumes only 15 mW power from a 1-V supply.

引用

页码：315 / 316

页数：2

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