Test Chip Fabrication with Extreme Ultraviolet Lithography for High-Volume Manufacturing

被引:0
|
作者
Mori, I. [1 ]
Aoyama, H. [1 ]
机构
[1] Semicond Leading Edge Technol Inc Selete, Tsukuba, Ibaraki 3058569, Japan
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TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Since launching the project to get extreme ultraviolet lithography (EUVL) ready for production, we focused on two issues: test chip fabrication down to a half pitch (hp) of 28 nm to assess an applicability of EUVL to the fabrication of logic devices (BEOL test chip); and the manufacturability of EUVL, for which we used a special PL test site to assess the electrical yield. Furthermore, we examined the potential of EUVL for device fabrication at sizes beyond hp 24 nm.
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