Effect of pulse magnetic field on solidification structure and properties of pure copper

被引：0
|
作者：
Liao Xi-liang [1 ,2 ]
Gong Yong-yong [1 ]
Li Ren-xing [1 ]
Chen Wen-jie [1 ]
Zhai Qi-jie [1 ]
机构：
[1] Shanghai Univ, Sch Mat Sci & Engn, Shanghai 200072, Peoples R China
[2] Shandong Univ, Sch Mech Engn, Jinan 250061, Peoples R China
来源：
CHINA FOUNDRY | 2007年 / 4卷 / 02期
关键词：
pure copper; pulse magnetic field; solidification structure; property;
D O I：
暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
The application of pulse magnetic field to metal solidification is an advanced technique which can remarkably refine solidification structure. In this paper, the effect of pulse magnetic field on solidification structure, mechanical properties and conductivity of pure copper was experimentally investigated. The results showed that the solidification structure transformed from coarse columnar crystal to fine globular crystal with increasing pulse voltage. Increasing pulse voltage also improved the tensile strength. However, with the increase of pulse voltage, the elongation and electrical resistivity firstly decreased, then increased when the pulse voltage beyond a critical value. Moreover, in some conditions, pulse magnetic field can simultaneously improve the conductivity and mechanical property of pure copper.
引用
收藏
页码：116 / 119
页数：4
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