Thermal conductivity of diamond particle dispersed aluminum matrix composites fabricated in solid-liquid co-existent state by SPS

被引:55
|
作者
Mizuuchi, Kiyoshi [1 ]
Inoue, Kanryu [2 ]
Agari, Yasuyuki [1 ]
Morisada, Yoshiaki [1 ]
Sugioka, Masami [1 ]
Tanaka, Motohiro [1 ]
Takeuchi, Takashi [1 ]
Kawahara, Masakazu [3 ]
Makino, Yukio [4 ]
机构
[1] Osaka Municipal Tech Res Inst, Joto Ku, Osaka 5368553, Japan
[2] Univ Washington, Seattle, WA 98195 USA
[3] SPS SYNTEX INC, Takatsu Ku, Kawasaki, Kanagawa 2130012, Japan
[4] Osaka Univ, Joining & Welding Res Inst, Osaka 5670047, Japan
关键词
Metal-matrix composites (MMCs); Particle-reinforcement; Thermal properties; Sintering; PULSE CURRENT; MAGNETOSTRICTION; MICROSTRUCTURE; STRAIN;
D O I
10.1016/j.compositesb.2011.03.028
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Diamond particle dispersed aluminum (Al) matrix composites were fabricated in solid-liquid coexistent state from the powder mixture of diamond, pure Al and 5056-type Al-Mg alloy by spark plasma sintering (SPS) process. Microstructures and thermal conductivities of the composites fabricated were examined. These composites can be well consolidated at 813 K for 0.6 k s and scanning electron microscopy detects no reaction at the interface between the diamond particle and the Al matrix. The relative packing density of the diamond-Al composite fabricated was 97% or higher in a volume fraction range of diamond between 25.5 and 45.5%. The thermal conductivity of the Al matrix composite containing 45.5 vol.% diamond reached 403 W/mK, approximately 76% the theoretical thermal conductivity estimated by Maxwell-Eucken's equation. (C) 2011 Elsevier Ltd. All rights reserved.
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页码:1029 / 1034
页数:6
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