Thermal stress analysis on chemical vapor deposition tungsten coating as plasma facing material for EAST

被引：9

作者：

Zhu, Dahuan ^{[1
]}

Chen, Junling ^{[1
]}

机构：

[1] Chinese Acad Sci, Inst Plasma Phys, Hefei 230031, Peoples R China

来源：

JOURNAL OF NUCLEAR MATERIALS | 2014年 / 455卷 / 1-3期

基金：

中国国家自然科学基金;

关键词：

Coatings - Zirconium alloys - Chemical analysis - Residual stresses - Functionally graded materials - Chromium alloys - Ternary alloys - Stress concentration - Vacuum applications - Composite films;

D O I：

10.1016/j.jnucmat.2014.05.054

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Chemical vapor deposition-tungsten (CVD-W) coating on CuCrZr surface forming a flat-type structure is likely to be used as the vacuum wall materials except the divertor areas in EAST during its up-grade phase. This paper describes the residual thermal stress distribution in CVD-W coating substrate system using finite element analysis method (ANSYS code). Especially, the influence of interlayers, i.e. oxygen-free Cu (OFC) and W/Cu functionally gradient materials (FGMs) interlayer have been investigated in view of stress alleviation. Both the OFC and W/Cu FGMs interlayer can reduce the residual thermal stress, in which the OFC shows better interface and surface stress distribution than W/Cu FGMs, and is a preferred interlayer for CVD-W coating processing. (C) 2014 Elsevier B.V. All rights reserved.

引用

页码：185 / 188

页数：4

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