Method for measuring thermal accommodation coefficients of gases on thin film surfaces using a MEMS sensor structure

被引：15

作者：

Grau, Mario ^{[1
]}

Voelklein, Friedemann ^{[1
]}

Meier, Andreas ^{[1
]}

Kunz, Christina ^{[1
]}

Heidler, Jonas ^{[1
]}

Woias, Peter ^{[2
]}

机构：

[1] RheinMain Univ Appl Sci, Inst Microtechnol, D-65428 Russelsheim, Germany

[2] Univ Freiburg, Dept Microsyst Engn, D-79110 Freiburg, Germany

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A | 2016年 / 34卷 / 04期

关键词：

ENERGY; EXCHANGE;

D O I：

10.1116/1.4948527

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

A method for measuring the thermal accommodation coefficient a for surface-/gas interfaces is presented. It allows the determination of a for thin films produced by a variety of deposition technologies, such as chemical vapor deposition, physical vapor deposition, and atomic layer deposition (ALD). The setup is based on two microelectromechanical systems (MEMS) Pirani sensors facing each other in a defined positioning. Because these MEMS sensors show a very high sensitivity in their individual molecular flow regimes, it is possible to measure the accommodation coefficients of gases without the disturbing influence of the transition regime. This paper presents the analytical background and the actual measurement principle. The results for air and nitrogen molecules on sputtered Au and Pt surfaces are presented. (C) 2016 American Vacuum Society.

引用

页数：7

共 50 条

[21] Efficient thermal utilization in MEMS bulk micromachined pyroelectric infrared sensor using thermal oxide thin layer
Surender P. Gaur
Prem Kumar
Kamaljit Rangra
Dinesh Kumar
Microsystem Technologies, 2018, 24 : 1603 - 1608
[22] Efficient thermal utilization in MEMS bulk micromachined pyroelectric infrared sensor using thermal oxide thin layer
Gaur, Surender P.
Kumar, Prem
Rangra, Kamaljit
Kumar, Dinesh
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2018, 24 (03): : 1603 - 1608
[23] Thermal characterisation of μL volumes using a thin film thermocouple based sensor
Atherton, J. J.
Rosamond, M. C.
Johnstone, S.
Zeze, D. A.
SENSORS AND ACTUATORS A-PHYSICAL, 2011, 166 (01) : 34 - 39
[24] Temperature Monitoring in Laser Assisted Polymer Bonding for MEMS Packaging Using a Thin Film Sensor Array
Lu, Yufei
Zeng, Jun
Wang, Changhai
SAS 2009 - IEEE SENSORS APPLICATIONS SYMPOSIUM, PROCEEDINGS, 2009, : 52 - 55
[25] Measurement of thin film thermal conductivity using the laser flash method
Ruoho, Mikko
Valset, Kjetil
Finstad, Terje
Tittonen, Ilkka
NANOTECHNOLOGY, 2015, 26 (19)
[26] IMPROVEMENT OF THE METHOD FOR MEASURING GLOSSINESS OF CURVED SURFACES USING CCD LINE SENSOR.
Aida, Teizo
Hayasaki, Satoru
Mizutani, Seizi
Sakaue, Yutaka
Kugisawa, Hideo
Transactions of the Institute of Electronics, Information and Communication Engineers, Section E (, 1987, E70 (04): : 352 - 354
[27] Thermal Analysis of Traction Contact Area Using a Thin-film Temperature Sensor
Inoue, Masashi
Takeuchi, Yasuhiro
Yorinaga, Muneo
Sano, Toshinari
Tomita, Mitsuaki
SAE INTERNATIONAL JOURNAL OF PASSENGER CARS-MECHANICAL SYSTEMS, 2013, 6 (02): : 578 - 583
[28] Compacting pressure measuring method in autoclave processing of polymer composites using film sensor
Gu, Y. (benniegu@buaa.edu.cn), 1600, Beijing University of Aeronautics and Astronautics (BUAA) (30):
[29] Measuring thermal properties of thin layers with rough surfaces by using the bidirectional heat flow approach
Fladischer, Katrin
Leitgeb, Verena
Fernbach, Simon
Mitterhuber, Lisa
TM-TECHNISCHES MESSEN, 2022, 89 (05) : 343 - 351
[30] A Laser-Assisted Bonding Method Using a Liquid Crystal Polymer Film for MEMS and Sensor Packaging
Jiang, Xin
Wang, Changhai
Liu, Wei
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2015, 5 (05): : 583 - 591

← 1 2 3 4 5 →