Elastoplastic analysis of W-Cu functionally graded materials subjected to a thermal shock by micromechanical model

We consider the transient elastoplastic behavior of the functionally graded divertor plate due to a thermal shock with temperature-dependent properties. The development of a micromechanical model for functionally graded materials is presented, and its application to thermoelastoplastic analysis is discussed for the case of the W-Cu functionally graded material for the international thermonuclear experimental reactor divertor plate. The divertor plate consists of a graded layer bonded between a homogeneous substrate and a homogeneous coating, and it is subjected to a cycle of heating and cooling on the coating surface of the material. The material properties of the divertor plate are dependent on the temperature and the position. Numerical results presented include the transient elastoplastic stresses.