Mechanical response of atomic layer deposition alumina coatings on stiff and compliant substrates

被引:32
|
作者
Bull, Steve J. [1 ]
机构
[1] Newcastle Univ, Sch Chem Engn & Adv Mat, Newcastle Upon Tyne NE1 7RU, Tyne & Wear, England
来源
关键词
INDENTATION; FILMS; FRACTURE; HARDNESS; MODULUS; GROWTH; LOAD;
D O I
10.1116/1.3670401
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
In this study, the mechanical properties of atomic layer deposition (ALD) alumina coatings deposited at a range of temperatures from 80 degrees C onto substrates with differing stiffness including hard, stiff materials (silicon and glass) and soft, compliant materials (PET) have been investigated by nanoindentation. Approaches necessary to extract coating properties from the coating/substrate composite data have been developed in order to obtain reliable data from 150nm thick coatings on hard, stiff substrates. This has shown that the elastic modulus of ALD alumina increases with deposition temperature as might be expected from the variation in density. Measurements for the ALD alumina coatings on PET using the same analysis method give lower elastic Modulus and hardness values; this is not due to an intrinsic difference in coating properties but is a consequence of the effect of modulus mismatch between coating and substrate on the measurement method. Reliable data for the coatings on PET are therefore more difficult to obtain but can be determined if a suitable modeling approach is adopted. (C) 2012 American Vacuum Society. [DOI: 10.1116/1.3670401]
引用
收藏
页数:8
相关论文
共 50 条
  • [31] Ferromagnetic nanotubes by atomic layer deposition in anodic alumina membranes
    Daub, M.
    Knez, M.
    Goesele, U.
    Nielsch, K.
    Journal of Applied Physics, 2007, 101 (09):
  • [32] Simulating the atomic layer deposition of alumina from first principles
    Elliott, SD
    Greer, JC
    JOURNAL OF MATERIALS CHEMISTRY, 2004, 14 (21) : 3246 - 3250
  • [33] Inductively coupled plasma nanoetching of atomic layer deposition alumina
    Han, Anpan
    Chang, Bingdong
    Todeschini, Matteo
    Hoa Thanh Le
    Tiddi, William
    Keil, Matthias
    MICROELECTRONIC ENGINEERING, 2018, 193 : 28 - 33
  • [34] Chiral templating of alumina nanofilms by the atomic layer deposition process
    Shalev, O. L.
    Carmiel, Y.
    Gottesman, R.
    Tirosh, S.
    Mastai, Y.
    CHEMICAL COMMUNICATIONS, 2016, 52 (81) : 12072 - 12075
  • [35] Enhancement of Wetting and Mechanical Properties of UHMWPE-Based Composites through Alumina Atomic Layer Deposition
    Shimel, Meni
    Gouzman, Irina
    Grossman, Eitan
    Barkay, Zahava
    Katz, Sari
    Bolker, Asaf
    Eliaz, Noam
    Verker, Ronen
    ADVANCED MATERIALS INTERFACES, 2018, 5 (14):
  • [36] Toughness and adhesion of atomic layer deposited alumina films on polycarbonate substrates
    Latella, B. A.
    Triani, G.
    Evans, P. J.
    SCRIPTA MATERIALIA, 2007, 56 (06) : 493 - 496
  • [37] Mechanical properties of atomic layer deposition (ALD) TiO2 layers on stainless steel substrates
    Basiaga, M.
    Staszuk, M.
    Walke, W.
    Opilski, Z.
    MATERIALWISSENSCHAFT UND WERKSTOFFTECHNIK, 2016, 47 (5-6) : 512 - 520
  • [38] Atomic layer deposition of aluminum oxide on modified steel substrates
    Kukli, Kaupo
    Salmi, Emma
    Jogiaas, Taivo
    Zabels, Roberts
    Schuisky, Mikael
    Westlinder, Jorgen
    Mizohata, Kenichiro
    Ritala, Mikko
    Leskela, Markku
    SURFACE & COATINGS TECHNOLOGY, 2016, 304 : 1 - 8
  • [39] Mechanisms of atomic layer deposition on substrates with ultkahigh aspect ratios
    Kucheyev, S. O.
    Biener, J.
    Baumann, T. F.
    Wang, Y. M.
    Hamza, A. V.
    Li, Z.
    Lee, D. K.
    Gordon, R. G.
    LANGMUIR, 2008, 24 (03) : 943 - 948
  • [40] Electrochemical and Surface Analysis of the Corrosion Protection of Copper by Nanometer-Thick Alumina Coatings Prepared by Atomic Layer Deposition
    Mirhashemihaghighi, Shadi
    Swiatowska, Jolanta
    Maurice, Vincent
    Seyeux, Antoine
    Klein, Lorena H.
    Harkonen, Emma
    Ritala, Mikko
    Marcus, Philippe
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2015, 162 (08) : C377 - C384