Triple junction effects in solids

被引：43
|
作者：
Zhao, B. [1 ]
Gottstein, G. [1 ]
Shvindlerman, L. S. [1 ,2 ]
机构：
[1] Rhein Westfal TH Aachen, Inst Met Kunde & Met Phys, Aachen, Germany
[2] Russian Acad Sci, Inst Solid State Phys, Chernogolovka 142432, Russia
来源：
ACTA MATERIALIA | 2011年 / 59卷 / 09期
关键词：
Grain boundary triple junction; Zener drag; Gibbs-Thompson equation; Triple line energy; GRAIN-BOUNDARY MOTION; PARTICLES; ENERGY; SIMULATION;
D O I：
10.1016/j.actamat.2011.02.024
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The grain boundary free surface triple line tension and grain boundary triple line tension were investigated in copper using a recently introduced novel approach. The effect of triple line tension on grain growth, Zener drag and Gibbs-Thompson relation was studied. The results showed that the triple line tension has a considerable effect on grain growth, particle boundary interactions and void shape, especially for nanocrystalline materials. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码：3510 / 3518
页数：9
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