High Speed Interconnects of Multi-layer PCB Analysis by Using Non-conformal Domain Decomposition Method

被引：2
|
作者：
Shao, Yang [1 ]
Peng, Zhen [1 ]
Lee, Jin-Fa [1 ]
机构：
[1] Ohio State Univ, Electrosci Lab, Columbus, OH 43212 USA
来源：
2010 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC 2010) | 2010年
关键词：
Domain decomposition method; Signal Integrity; Second order transmission conditions; Maxwell's equations;
D O I：
10.1109/ISEMC.2010.5711351
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A non-conformal domain decomposition method (DDM) is proposed to investigate signal integrity (SI) of highspeed interconnects on multi-scale, multi-layer printed circuit board (PCB) in this paper. The accuracy and robustness of the proposed method is first demonstrated by analysis of a 4-layer differential pair. Then we studied a 14-layer 16 traces interconnect model to demonstrate the efficiency of the method. Eye diagrams of the two models are studied for time domain SI.
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页码：637 / 642
页数：6
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