Investigation of strengthening mechanisms in an additively manufactured Haynes 230 alloy

被引:73
|
作者
Yang, Bo [1 ]
Shang, Z. [1 ]
Ding, Jie [1 ]
Lopez, Jack [1 ,2 ]
Jarosinski, William [2 ]
Sun, T. [1 ]
Richter, N. [1 ]
Zhang, Y. [1 ]
Wang, H. [1 ,3 ]
Zhang, X. [1 ]
机构
[1] Purdue Univ, Sch Mat Engn, W Lafayette, IN 47907 USA
[2] Praxair Surface Technol Inc, Indianapolis, IN 46222 USA
[3] Purdue Univ, Sch Elect & Comp Engn, W Lafayette, IN 47907 USA
关键词
Additive manufacturing; Haynes 230 Ni superalloy; well-aligned nanoprecipitates; mechanical properties; strengthening mechanism; NICKEL-BASED SUPERALLOY; COMPLEX MELT FLOW; M23C6; CARBIDE; DELTA-PHASE; MICROSTRUCTURAL EVOLUTION; DEFORMATION-BEHAVIOR; HEAT-TREATMENT; CR-W; LASER; KINETICS;
D O I
10.1016/j.actamat.2021.117404
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
There are abundant studies on additive manufacturing of Ni alloys, such as Inconel 718. However, the studies on the microstructure and the deformation behavior of solid solution strengthened Ni alloys, such as Haynes 230, are limited. Here we compare the microstructure and the mechanical behavior of as-printed and stress-relieved Haynes 230 Ni alloys prepared by laser powder bed fusion. Transmission electron microscopy analysis revealed M23C6 carbides decorated at the dislocation cell walls in the as-printed material transformed to well-aligned arrays of M6C nanoprecipitates separated by an array spacing of 500 nm after stress-relief (heat treatment). The nanoprecipitates in stress-relieved alloy have formed numerous aligned orientation relationships with the matrix despite their large lattice mismatch. Post-tension microscopy analyses demonstrated high-density dislocation networks in the as-printed samples, whereas high-density stacking faults and nanoscale deformation twins were observed in the stress-relieved counterparts. This study provides insights for understanding the influence of nanoprecipitates on the deformation mechanisms of additively manufactured Ni alloys. (C) 2021 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
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页数:15
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