Investigation of the thermomechanical behavior of nonhomogeneous, layered materials with mixed-mode cracks subjected to rapid thermal shock loading

被引:3
|
作者
Zhang, Yanyan [1 ,2 ]
Chen, Zengtao [2 ]
Zheng, Tao [3 ]
Guo, Licheng [3 ]
Hu, Xiongfeng [2 ]
机构
[1] Civil Aviat Flight Univ China, Sch Astronaut, Guanghan 618307, Peoples R China
[2] Univ Alberta, Dept Mech Engn, Edmonton, AB T6G 1H9, Canada
[3] Harbin Inst Technol, Sch Astronaut, Harbin 150001, Peoples R China
基金
中国国家自然科学基金;
关键词
Newmark method; Transient thermal stress intensity factors; Interaction energy integral method; Mixed-mode cracks; Interface; STRESS INTENSITY FACTORS; FOURIER HEAT-CONDUCTION; FRACTURE-ANALYSIS; INTERFACE; LEQUATION; CERAMICS; NOTCHES; PLATE; STRIP;
D O I
10.1016/j.tafmec.2022.103508
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
For mixed-mode, thermal shock crack problems with thermal lagging behaviors, it is difficult to obtain the transient thermal stress intensity factors (TSIFs). This paper aims to develop a method combining the Newmark method and the transient interaction energy integral method (IEIM) to extract the transient, mixed-mode TSIFs of nonhomogeneous, layered materials with mixed-mode cracks. The transient temperature field obtained by non -Fourier heat conduction theory is discretized in the spatial and temporal domains through the finite element method (FEM) and Newmark method, respectively. The effect of the continuity of thermomechanical parameters at the dual interface on the transient, mixed-mode TSIFs of nonhomogeneous, layered materials is discussed, then the fracture resistance of nonhomogeneous, layered materials is evaluated. Moreover, the maximum hoop stress criterion is utilized to obtain the crack growth angle and the equivalent, transient TSIFs of nonhomogeneous, layered materials. The influences of the interface on crack growth angle and equivalent transient TSIFs of nonhomogeneous layered materials are also studied. The present work is beneficial for the thermal design of nonhomogeneous, layered materials with mixed-mode cracks subjected to rapid thermal shock loading.
引用
收藏
页数:15
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