HETEROGENEOUS 3D INTEGRATION FOR INTERNET OF THINGS

被引：0
|
作者：
Koyanagi, Mitsumasa [1 ]
机构：
[1] Tohoku Univ, New Ind Creat Hatchery Ctr, Sendai, Miyagi 9808579, Japan
来源：
2014 12TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT) | 2014年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
To overcome various concerns caused by scaling-down the device size in future LSIs, it is indispensable to introduce a new concept of heterogeneous 3D integration in which various kinds of device chips with different size, different devices and different materials are vertically stacked. To achieve such heterogeneous 3D integration, a key technology of self-assembly and electrostatic (SAE) bonding has been developed. Exploring new devices for the IoT, we have fabricated several kinds of heterogeneous 3D LSIs called super-chip by stacking compound semiconductor device chip, photonic device chip and spintronic device chip on CMOS device chips using SAE bonding.
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