A hybrid life cycle inventory of nano-scale semiconductor manufacturing

被引:84
|
作者
Krishnan, Nikhil [1 ]
Boyd, Sarah [2 ]
Somani, Ajay
Raoux, Sebastien [3 ]
Clark, Daniel [4 ]
Dornfeld, David [2 ]
机构
[1] Columbia Univ, New York, NY 10027 USA
[2] Univ Calif Berkeley, Berkeley, CA 94720 USA
[3] Transcarbon Int, San Francisco, CA USA
[4] Appl Mat Inc, Santa Clara, CA 95054 USA
关键词
D O I
10.1021/es071174k
中图分类号
X [环境科学、安全科学];
学科分类号
08 ; 0830 ;
摘要
The manufacturing of modern semiconductor devices involves a complex set of nanoscale fabrication processes that are energy and resource intensive, and generate significant waste. It is important to understand and reduce the environmental impacts of semiconductor manufacturing because these devices are ubiquitous components in electronics. Furthermore, the fabrication processes used in the semiconductor industry are finding increasing application in other products, such as microelectromechanical systems (MEMS), flat panel displays, and photovoltaics. In this work we develop a library of typical gate-to-gate materials and energy requirements, as well as emissions associated with a complete set of fabrication process models used in manufacturing a modern microprocessor. In addition, we evaluate upstream energy requirements associated with chemicals and materials using both existing process life cycle assessment (LCA) databases and an economic input-output (EIO) model. The result is a comprehensive data set and methodology that may be used to estimate and improve the environmental performance of a broad range of electronics and other emerging applications that involve nano and micro fabrication.
引用
收藏
页码:3069 / 3075
页数:7
相关论文
共 50 条
  • [41] Die Bonding of Single Emitter Semiconductor Laser with Nano-Scale Silver Paste
    Yan, Yi
    Chen, Xu
    Liu, XingSheng
    Lu, Guo-Quan
    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 1143 - 1147
  • [42] A hybrid life-cycle inventory for multi-crystalline silicon PV module manufacturing in China
    Yao, Yuan
    Chang, Yuan
    Masanet, Eric
    ENVIRONMENTAL RESEARCH LETTERS, 2014, 9 (11):
  • [43] Accurate numerical models for simulation of radiation events in nano-scale semiconductor devices
    Fedoseyev, Alexander I.
    Turowski, Marek
    Alles, Michael L.
    Weller, Robert A.
    MATHEMATICS AND COMPUTERS IN SIMULATION, 2008, 79 (04) : 1086 - 1095
  • [44] Interfacial residual stresses in semiconductor devices measured on the nano-scale by cathodoluminescence piezospectroscopy
    Pezzotti, Giuseppe
    Designing of Interfacial Structures in Advanced Materials and their Joints, 2007, 127 : 123 - 128
  • [45] Reusable unit process life cycle inventory for manufacturing: stereolithography
    Timothy Simon
    Yiran Yang
    Wo Jae Lee
    Jing Zhao
    Lin Li
    Fu Zhao
    Production Engineering, 2019, 13 : 675 - 684
  • [46] Reusable unit process life cycle inventory for manufacturing: grinding
    Linke B.
    Overcash M.
    Production Engineering, 2017, 11 (6) : 643 - 653
  • [47] UNIT PROCESS LIFE CYCLE INVENTORY FOR PRODUCT MANUFACTURING OPERATIONS
    Overcash, Michael
    Twomey, Janet
    Kalla, Devi
    PROCEEDINGS OF THE ASME INTERNATIONAL MANUFACTURING SCIENCE AND ENGINEERING CONFERENCE, VOL 1, 2009, : 49 - 55
  • [48] Reusable unit process life cycle inventory for manufacturing: stereolithography
    Simon, Timothy
    Yang, Yiran
    Lee, Wo Jae
    Zhao, Jing
    Li, Lin
    Zhao, Fu
    PRODUCTION ENGINEERING-RESEARCH AND DEVELOPMENT, 2019, 13 (06): : 675 - 684
  • [49] Effects of Spatial Scale on Life Cycle Inventory Results
    Yang, Yi
    Pelton, Rylie E. O.
    Kim, Taegon
    Smith, Timothy M.
    ENVIRONMENTAL SCIENCE & TECHNOLOGY, 2020, 54 (03) : 1293 - 1303
  • [50] A glance of technology efforts for design-for-manufacturing in nano-scale CMOS processes
    YuHua Cheng
    Science in China Series F: Information Sciences, 2008, 51 : 807 - 818