Power Integrity Simulation for SiP Using GTLE

被引：0
|
作者：
Zhou, Yunyan [1 ]
Wan, Lixi [1 ]
Li, Jun [1 ]
机构：
[1] Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
来源：
2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009) | 2009年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Power integrity (PI) simulation for system-in-package (SiP) is a bottleneck in SiP design flow. This paper presents a novel numerical algorithm for PI simulation in packaging structures. This algorithm is based on 2D Generalized Transmission Line Equation (GTLE), Finite Difference Frequency Domain (FDFD) and mesh division technique. The power distribution network is simulated using mesh division technique where the model of power distribution network is obtained by regarding each cell as a 2D transmission line. 2D GTLE is a group partial equation about voltage and current density distribution on a power/ground plane pair. After reduction, the voltage equation for 2D GTLE is obtained, which is a Helmholtz equation. One method to solve the Helmholtz equation is by the finite-difference scheme. The 2D Laplace operator can be approximated to solve the voltage equation. In this paper, the fringe effect is modeled by the addition of cells around edges which is efficient and easy to implement. Finally, the methodology described in prior sections has been implemented in a CAD tool. The results from our method were compared to those from a full-wave simulator to show efficiency in power integrity simulation.
引用
收藏
页码：349 / 352
页数：4
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