A SPICE-Based Simulation Method for System Efficient Electrostatic Discharge Design

被引：0
|
作者：
Wang, Yuan [1 ]
机构：
[1] Peking Univ, Sch Integrated Circuits, Beijing 100871, Peoples R China
来源：
6TH IEEE ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING CONFERENCE (EDTM 2022) | 2022年
关键词：
ESD; SEED; TLP; system-level;
D O I：
10.1109/EDTM53872.2022.9798202
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Based on system efficient electrostatic discharge design (SEED) methodology, this paper proposes a high-order SPICE simulation methodology to predict the performance of the ESD protection circuits. The related PCB-level experiments of the selected protection circuits are fulfilled to verify this method. As a result, the consistency of the comparison results between the simulation and measurement illustrates that the method can accurately predict the performance of system-level protection circuits.
引用
收藏
页码：229 / 231
页数：3
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