Fabrication of Ni-W electroplated micro diamond grinding tools and their application to grooving in silicon

被引：0
|
作者：
Nishirara, K [1 ]
Onikura, H [1 ]
Sakase, T [1 ]
机构：
[1] Kyushu Polytech Coll, Kitakyushu, Fukuoka 8020985, Japan
来源：
PROGRESS OF MACHINING TECHNOLOGY | 2004年
关键词：
Ni-W electroplating; diamond; micro grinding tools; current density; grooving;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Ni-W electroplated micro diamond grinding tools with cylindrical carbide substrate having a diameter of 100 mu m were fabricated in ammonium citrate bath with the intention of improving the grain holding and the tool life. The comparison of these tools with Ni electroplated tools in tool life shows that the former are superior to the latter. The optimum conditions for current density and time of electroplating were obtained from the viewpoint of tool life in grooving of silicon.
引用
收藏
页码：116 / 121
页数：6
相关论文
共 50 条
  • [21] Fabrication of electroplated micro grinding wheels and manufacturing of microstructures with ultrasonic vibration
    Onikura, H
    Inoue, R
    Okuno, K
    Ohnishi, O
    ADVANCES IN ABRASIVE TECHNOLOGY V, 2003, 238-2 : 9 - 14
  • [22] Wetting Behaviour of Lead Free Solder on Electroplated Ni and Ni-W Alloy Barrier Film
    Chew, C. S.
    Haseeb, A. S. M. A.
    Johan, M. R.
    INEC: 2010 3RD INTERNATIONAL NANOELECTRONICS CONFERENCE, VOLS 1 AND 2, 2010, : 267 - 268
  • [23] Ultrasonically assisted grinding for mirror surface finishing of dies with electroplated diamond tools
    Isobe, Hiromi
    Hara, Keisuke
    Kyusojin, Akira
    Okada, Manabu
    Yoshihara, Hideo
    INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 2007, 8 (02) : 38 - 43
  • [24] Characterization of geometrical properties of electroplated diamond tools and estimation of its grinding performance
    Ismail, Mohd Fauzi
    Yanagi, Kazuhisa
    Isobe, Hiromi
    WEAR, 2011, 271 (3-4) : 559 - 564
  • [25] Wetting Behaviour of Lead Free Solder on Electroplated Ni and Ni-W Alloy Barrier Film
    Chew, C. S.
    Haseeb, A. S. M. A.
    Johan, M. R.
    2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, : 715 - 718
  • [26] Effect of variations in Ni-W molar ratio on the microstructure, mechanical properties and tribology of electrodeposited Ni-W/diamond composite coatings
    Das, Malay Kumar
    Qin, Jiaqian
    Bovornratanaraks, Thiti
    NANOCOMPOSITES, 2023, 9 (01) : 50 - 67
  • [27] REACTION OF AMORPHOUS NI-W AND NI-N-W FILMS WITH SUBSTRATE SILICON
    ZHU, MF
    SUNI, I
    NICOLET, MA
    SANDS, T
    JOURNAL OF APPLIED PHYSICS, 1984, 56 (10) : 2740 - 2745
  • [28] A review on fabrication, grinding performance and failure of micro-grinding tools
    Batham, Himanshu
    Patel, Dharmendra
    Banerjee, Tushar
    MATERIALS TODAY-PROCEEDINGS, 2022, 66 : 3870 - 3877
  • [29] Fabrication of micro carbide tools by ultrasonic vibration grinding
    Onikura, H.
    Ohnishi, O.
    Take, Y.
    CIRP Annals - Manufacturing Technology, 2000, 49 (01) : 257 - 260
  • [30] Fabrication of micro carbide tools by ultrasonic vibration grinding
    Onikura, H
    Ohnishi, O
    Take, Y
    CIRP ANNALS 2000: MANUFACTURING TECHNOLOGY, 2000, : 257 - 260
12345