Fabrication of Ni-W electroplated micro diamond grinding tools and their application to grooving in silicon

被引：0
|
作者：
Nishirara, K [1 ]
Onikura, H [1 ]
Sakase, T [1 ]
机构：
[1] Kyushu Polytech Coll, Kitakyushu, Fukuoka 8020985, Japan
来源：
PROGRESS OF MACHINING TECHNOLOGY | 2004年
关键词：
Ni-W electroplating; diamond; micro grinding tools; current density; grooving;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Ni-W electroplated micro diamond grinding tools with cylindrical carbide substrate having a diameter of 100 mu m were fabricated in ammonium citrate bath with the intention of improving the grain holding and the tool life. The comparison of these tools with Ni electroplated tools in tool life shows that the former are superior to the latter. The optimum conditions for current density and time of electroplating were obtained from the viewpoint of tool life in grooving of silicon.
引用
收藏
页码：116 / 121
页数：6
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