Improvement of plating adhesion on PhotoVia substrates

被引：0

作者：

Hamacek, A. ^{[1
]}

Kidora, J. ^{[1
]}

Reboun, J. ^{[1
]}

机构：

[1] Univ W Bohemia, Dept Technol & Measurement, Fac Elect Engn, Plzen, Czech Republic

来源：

2007 30TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY | 2007年

关键词：

D O I：

10.1109/ISSE.2007.4432848

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper deals with the microvia substrates. Microvia substrates are high density multilayer printed circuits boards with the reduced diameter of interconnection vias. Photo Via method was used for the creation of microvias by photolithography. For this method, the photoimageable dielectric materials have to be used. This report deals with special composite photodielectrics. Unlike the convention photosensitive dielectrics, these materials do not require any special surface treatment due to the adhesion improvement. Experiments with variable quantity of ceramic filler were executed. Roughness of dielectric surface and adhesion of conductive layer were measured.

引用

页码：203 / 207

页数：5

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