Lasers aid packaging of integrated-circuit devices

被引：0

|

作者：

Zankowsky, D

机构：

来源：

LASER FOCUS WORLD | 1998年 / 34卷 / 12期

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D O I：

暂无

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

Laser micromachining enables special packaging applications used to create complex IC devices.

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页码：135 / +

页数：4

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