Assessment of Microelectronics Interconnect Reliability - Current Practice and Trends

被引：0
|
作者：
Borgesen, Peter [1 ]
机构：
[1] SUNY Binghamton, Dept Syst Sci & Ind Engn, Binghamton, NY 13902 USA
来源：
2014 15TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME) | 2014年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页数：5
相关论文
共 50 条
  • [1] CURRENT TRENDS IN HUMAN RELIABILITY ASSESSMENT
    Kirwan, Barry
    Gibson, Huw
    [J]. CONTEMPORARY ERGONOMICS 2008, 2008, : 158 - +
  • [2] Modern Trends in Microelectronics Packaging Reliability Testing
    Bender, Emmanuel
    Bernstein, Joseph B.
    Boning, Duane S.
    [J]. MICROMACHINES, 2024, 15 (03)
  • [3] CURRENT TRENDS IN HYBRID MICROELECTRONICS MANUFACTURING.
    Treese, Kaye D.
    [J]. SME Technical Paper (Series) EE, 1979, (EE79-22):
  • [4] Assessment of via reliability for interconnect layouts
    SiTD, Texas Instruments Inc., MS366, 13121 TI BL VD, Dallas, TX 75243, United States
    [J]. Adv. Metallization Conf. (AMC), (667-671):
  • [5] FAIR - Fast Assessment of Interconnect Reliability
    Mei, ZQ
    [J]. 48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, : 268 - 276
  • [6] Assessment of via reliability for interconnect layouts
    Lee, Ki-Don
    Park, Young-Joon
    [J]. ADVANCED METALLIZATION CONFERENCE 2007 (AMC 2007), 2008, 23 : 667 - 671
  • [7] Accurate Current Estimation for Interconnect Reliability Analysis
    Jain, Palkesh
    Jain, Ankit
    [J]. IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2012, 20 (09) : 1634 - 1644
  • [8] Interconnect technology trend for microelectronics
    Liu, RC
    Pai, CS
    Martinez, E
    [J]. SOLID-STATE ELECTRONICS, 1999, 43 (06) : 1003 - 1009
  • [9] A Survey of Current Trends in Master's Programs in Microelectronics
    Bozanic, Mladen
    Sinha, Saurabh
    [J]. IEEE TRANSACTIONS ON EDUCATION, 2018, 61 (02) : 151 - 157
  • [10] Reliability assessment of fielded plastic and hermetically packaged microelectronics
    Johnson, B
    Verma, V
    [J]. IEEE TRANSACTIONS ON RELIABILITY, 1996, 45 (01) : 23 - 26
12345