Microstructural characterization of copper corrosion in aqueous and soil environments

被引：34
|
作者：
Srivastava, A [1 ]
Balasubramaniam, R [1 ]
机构：
[1] Indian Inst Technol, Dept Mat & Met Engn, Kanpur 208016, Uttar Pradesh, India
来源：
MATERIALS CHARACTERIZATION | 2005年 / 55卷 / 02期
关键词：
copper; corrosion; soil; sur-face film; characterization;
D O I：
10.1016/j.matchar.2005.04.004
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Scanning electron microscopy has been used to investigate the surface films on pure copper after exposure to different aqueous and soil environments, containing chloride, sulfide and ammonium salts. The morphology of the films formed on copper surface in aqueous and soil environments was different for the same amount of pollutants. The surface films formed in soil environments were not homogenous in contrast to the films formed in aqueous environments. The damaging effect of chloride ions and the benign role of sulfide ions were revealed in both the environments. Local compositional analysis confirmed that the surface films formed on copper consisted predominantly of copper and oxygen. (c) 2005 Elsevier Inc. All rights reserved.
引用
收藏
页码：127 / 135
页数：9
相关论文
共 50 条
  • [21] Corrosion of copper alloys in consumer electronics environments
    Materion, 6070 Parkland Blvd., Mayfield Heights
    OH
    44124, United States
    Mater Perform, 12 (64-67):
  • [22] Corrosion of Copper Alloys in Consumer Electronics Environments
    Samant, Anand V.
    Grensing, Fritz C.
    MATERIALS PERFORMANCE, 2015, 54 (12) : 64 - 67
  • [23] Investigation of the microstructural growth of sulfide stress corrosion at simulated environments
    Deemantha, Akesh
    De Silva, Gip
    MORATUWA ENGINEERING RESEARCH CONFERENCE (MERCON 2021) / 7TH INTERNATIONAL MULTIDISCIPLINARY ENGINEERING RESEARCH CONFERENCE, 2021, : 173 - 177
  • [24] New characterization of copper corrosion
    不详
    SOLID STATE TECHNOLOGY, 2000, 43 (11) : 40 - 40
  • [25] Characterization of ethnographic copper corrosion
    Souissi, N.
    Triki, E.
    MATERIALS AND CORROSION-WERKSTOFFE UND KORROSION, 2009, 60 (04): : 262 - 268
  • [26] Nanoscale surface characterization of aqueous copper corrosion: Effects of immersion interval and orthophosphate concentration
    Daniels, Stephanie L.
    Sprunger, Phillip T.
    Kizilkaya, Orhan
    Lytle, Darren A.
    Garno, Jayne C.
    APPLIED SURFACE SCIENCE, 2013, 285 : 823 - 831
  • [27] CORROSION OF IRON IN GASEOUS ENVIRONMENTS AND IN GAS-SATURATED AQUEOUS ENVIRONMENTS
    RAMANARAYANAN, TA
    SMITH, SN
    CORROSION, 1990, 46 (01) : 66 - 74
  • [28] Microstructural characterization of interfaces between cold sprayed copper and electrodeposited copper corrosion barrier coatings for used nuclear fuel containers
    Zheng, Liyang
    Poirier, Dominique
    Legoux, Jean-Gabriel
    Giallonardo, Jason D.
    Howe, Jane Y.
    Erb, Uwe
    SURFACE & COATINGS TECHNOLOGY, 2024, 494
  • [29] Epoxy resin for solidification/stabilization of soil contaminated with copper (II): Leaching, mechanical, and microstructural characterization
    Ma, Qiang
    Lei, Jingjie
    He, Jun
    Chen, Zhi
    Li, Wentao
    ENVIRONMENTAL RESEARCH, 2024, 240
  • [30] Copper electrofaceting: corrosion of copper in phosphoric acid aqueous solutions
    Universidad de La Laguna, La Laguna, Spain
    Mater Sci Forum, pt 1 (525-534):
12345