Heat transfer with flow and phase change in an evaporator of miniature flat plate capillary pumped loop

被引：4

作者：

Wan, Zhongmin ^{[1
]}

Liu, Wei ^{[1
]}

Zheng, Zhaoqing ^{[1
]}

Nakayama, A. ^{[2
]}

机构：

[1] Huazhong Univ Sci & Technol, Coll Energy & Power Engn, Wuhan 430074, Peoples R China

[2] Shizuoka Univ, Dept Mech Engn, Hamamatsu, Shizuoka 4328561, Japan

来源：

JOURNAL OF THERMAL SCIENCE | 2007年 / 16卷 / 03期

关键词：

capillary pumped loop; flat plate evaporator; side wall effect heat transfer limit; wick structure;

D O I：

10.1007/s11630-007-0254-4

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

An overall two-dimensional numerical model of the miniature flat plate capillary pumped loop (CPL) evaporator is developed to describe the liquid and vapor flow, heat transfer and phase change in the porous wick structure, liquid flow and heat transfer in the compensation cavity and heat transfer in the vapor grooves and metallic wall. The entire evaporator is solved with SIMPLE algorithm as a conjugate problem. The effect of heat conduction of metallic side wall on the performance of miniature flat plate CPL evaporator is analyzed, and side wall effect heat transfer limit is introduced to estimate the performance of evaporator. The shape and location of vapor-liquid interface inside the wick are calculated and the influences of applied heat flux, liquid subcooling, wick material and metallic wall material on the evaporator performance are investigated in detail. The numerical results obtained are useful for the miniature flat plate evaporator performance optimization and design of CPL.

引用

页码：254 / 263

页数：10

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