A quantum dot based vertical cavity optical modulator for chip-to-chip interconnects in SiVLSI

被引：0
|
作者：
Shi, B [1 ]
Xie, YH [1 ]
机构：
[1] Univ Calif Los Angeles, Dept Mat Sci & Engn, Los Angeles, CA 90095 USA
来源：
2005 2nd IEEE International Conference on Group IV Photonics | 2005年
关键词：
D O I：
暂无
中图分类号：
O43 [光学];
学科分类号：
070207 ; 0803 ;
摘要：
引用
收藏
页码：146 / 148
页数：3
相关论文
共 50 条
  • [41] PARALLEL N2 WEIGHTED RECONFIGURABLE NETWORKS FOR OPTICAL NEURON AND CHIP-TO-CHIP INTERCONNECTS
    LI, Y
    EICHMANN, G
    OPTICS COMMUNICATIONS, 1988, 67 (04) : 251 - 255
  • [42] Boosting Off-chip Interconnects through Chip-to-Chip Capacitive Coupled Communication
    Zhang, Xiang
    Park, Dongwon
    Cheng, Chung-Kuan
    2017 IEEE 26TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS), 2017,
  • [43] New approaches for chip-to-chip interconnects: integrating porous silicon with MOEMS
    Song, Da
    Tokranova, Natalya
    Gracias, Alison
    Castracane, James
    JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2008, 7 (02):
  • [44] Performance Modeling and Broadband Characterization of Chip-to-Chip Interconnects with Rough Surfaces
    Kumar, Somesh
    Sharma, Rohit
    PROCEEDINGS OF THE 2016 IEEE 18TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2016, : 629 - 632
  • [45] Ultrawide Bandwidth Chip-to-Chip Interconnects for III-V MMICs
    Fay, Patrick
    Kopp, David
    Lu, Tian
    Neal, David
    Bernstein, Gary H.
    Kulick, Jason M.
    IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2014, 24 (01) : 29 - 31
  • [46] 3D chip-to-chip stacking with through silicon interconnects
    Lo, Wei-Chung
    Chang, Shu-Ming
    Chen, Yu-Hua
    Ko, Jeng-Dar
    Kuo, Tzu-Ying
    Chang, Hsiang-Hung
    Shih, Ying-Ching
    2007 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATIONS (VLSI-TSA), PROCEEDINGS OF TECHNICAL PAPERS, 2007, : 72 - +
  • [47] Development of a chip-to-chip optical interconnect system
    Mu, Jianwei
    Ragunathan, Vivek
    Zhang, Lin
    Okamoto, Shintaro
    Kimerling, Lionel C.
    Michel, Jurgen
    2013 IEEE OPTICAL INTERCONNECTS CONFERENCE, 2013, : 116 - +
  • [48] High-speed flex-circuit chip-to-chip interconnects
    Braunisch, Henning
    Jaussi, James E.
    Mix, Jason A.
    Trobough, Mark B.
    Horine, Bryce D.
    Prokofiev, Victor
    Lu, Daoqiang
    Baskaran, Rajashree
    Meier, Pascal C. H.
    Han, Dong-Ho
    Mallory, Kent E.
    Leddige, Michael W.
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2008, 31 (01): : 82 - 90
  • [49] High speed Si-based optical modulator for on-chip optical interconnects
    Marris, D
    Lupu, A
    Pascal, D
    Cercus, JL
    Vivien, L
    Cassan, E
    Laval, S
    PROCEEDINGS OF THE IEEE 2004 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2004, : 122 - 124
  • [50] Power-aware transceiver design for half-duplex bidirectional chip-to-chip optical interconnects
    Jamshid Sangirov
    Ikechi Augustine Ukaegbu
    Gulomjon Sangirov
    Tae-Woo Lee
    Hyo-Hoon Park
    Journal of Semiconductors, 2013, (12) : 64 - 69
12345